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G3-UV Laser Marking Machine 3W/5W
Marking

G3-UV Laser Marking Machine 3W/5W

UV laser marking machine is developed with 355nm Ultraviolet laser source for plastic, silicon, glass, ceramic, which adopts a third-order intracavity frequency doubling technology. Compared with infrared lasers, 355nm UV laser has a very small focus spot, which can greatly reduce the material mechanical deformation and processing heat influence is small. UV laser marking machine are mainly used for ultra-fine marking and engraving. It is especially suitable for food and medical packaging materials, marking, micro-holes, high-speed division of glass materials, and complex pattern cutting of silicon wafers.

Applicable Materials
PP (polypropylene), PC (polycarbonate), PE (polyethylene), ABS, PA, PMMA, Silicon, Glass, and Ceramics.

Technical parameters

Model
G3-UV
Laser type
Ultraviolet laser
Laser wavelength
355nm
Laser power
3W
Pulse length
< 18ns@40kHz
Marking area
110mmX110mm
Frequency range
20kHz-200kHz
Min line width
0.01mm
Min character
0.2mm
Accuracy of repetition
±0.003mm
Machine power
< 1.8KW
Electrical power requirement
220V/50HZ/60HZ or 110V/60HZ

See it running in Sharjah.

Book a live demo of the G3-UV Laser Marking Machine 3W/5W at our warehouse & demo center, or talk to an engineer about your material.

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